1,500 Tech Exhibitors from 33 Countries Gather at COMPUTEX 2026 to Accelerate Global Digital AI Economy & Business Opportunities

---

As Generative AI (GenAI), Agentic AI, and Physical AI continue to advance rapidly, the global technology industry is moving beyond individual models and computing power into a new phase integrating cloud, edge, terminal, and physical applications. AI is no longer merely a technology showcase — it has become the core driving force behind enterprise adoption, industrial transformation, and supply chain upgrades. COMPUTEX 2026, taking place on June 2–5, will center on the theme "AI TOGETHER", connecting the global AI ecosystem and offering a comprehensive view of the latest trends in AI's journey from innovation to real-world deployment — spanning AI infrastructure, AI computing platforms, Edge AI, AI PCs, Physical AI, and vertical industry applications.

Ahead of the show's opening, TCA (Taipei Computer Association), COMPUTEX co-organizer, will host the COMPUTEX 2026 Pre-Show Forum on May 27. The forum will bring together international companies and industry experts — including Google Cloud, MediaTek, McKinsey & Company, Hon Hai Research Institute, E Ink, and Acer Medical — to focus on key topics such as AI Systems, Enterprise AI adoption, AI Security, AI Chips, and Vertical Applications, previewing industry trends ahead this year’s COMPUTEX.

According to a research report by Gartner, global AI spending is projected to reach $2.59 trillion in 2026, representing a year-on-year growth rate of 47%. Of this, AI infrastructure spending will account for more than 45%, with AI-related server spending expected to triple within five years. As AI models, AI agents, and a wide range of AI applications continue to proliferate rapidly, enterprises are steadily expanding their AI investments and infrastructure deployments — making COMPUTEX 2026 a pivotal platform for observing the global AI supply chain and the real-world adoption of AI applications.

COMPUTEX 2026 Brings Together 1,500 Companies from 33 Countries — Exhibition Scale Breaks Records from Nangang to Xinyi

Asia's leading B2B technology trade show, COMPUTEX TAIPEI, will take place on June 2–5 at Taipei Nangang Exhibition Center Halls 1 & 2, TWTC Hall 1, and the Taipei International Convention Center (TICC). TCA announced that COMPUTEX 2026 will focus on four major technology trends: AI Computing, Robotics & Smart Mobility, Next-Generation Communications, and Sustainable Innovation. Three new exhibition zones have been added to TWTC Hall 1 – Robotics, TechXperience, and ePaper Pavilion. This year, 1,500 vendors from 33 countries and regions will occupy 6,000 booths across Nangang and Xinyi — setting a new all-time record for exhibition scale.

Domestic and International Tech Giants Gather — High-Profile Forum Speakers from Global Corporations, Venture Capital, and Corporate Venture Capital Attend

Major exhibitors at COMPUTEX 2026 include a wide range of domestic and international technology companies: Acer, ADATA, Advantech, ASPEED, ASRock, ASUS, Auras, BenQ, Compal, Delta Electronics, E Ink, Ennoconn, Foxconn, GIGABYTE, G.SKILL, Intel, InWin, Inventec, Jentech, KIOXIA Taiwan, LITEON, MediaTek, MSI, MiTAC Computing, NVIDIA, Pegatron, PSMC, QCT, Realtek, Samsung Electronics Taiwan, Siemens, Silicon Power, Supermicro, Thermaltake, Texas Instruments, Trend Micro, Vertiv Taiwan, Wiwynn, the Smart Mobility Pavilion, and the RISC-V Pavilion, among many others.

TCA noted that in response to the global AI boom, COMPUTEX and InnoVEX have organized a series of events — from pre-show to in-show — addressing diverse AI technology needs, real-world AI application trends, and AI startup investment. Invited speakers and participants include representatives from international corporations, global venture capital firms, and industry experts spanning Google Cloud, MediaTek, McKinsey & Company, Hon Hai Research Institute, E Ink, Acer Medical, Qualcomm, Intel, Marvell, NVIDIA, NXP, ABB, Microsoft, MIPS, Synopsys, Infineon, WD, Cadence, Advantech, TI, Siemens, Super Micro, Solidigm, Kioxia, MPS (Monolithic Power Systems), Flex, Dow Company, Endura Technologies, SambaNova, Zeiss, Schneider Electric, Hyundai Motor Group, AUMOVIO SE, Dassault Systèmes, Canva, LinkedIn, Micron Taiwan, Amazon Global Selling, JPC Connectivity, L'Oréal Taiwan, and Plug and Play Taiwan / Japan (listed in no particular order). Keynote sessions, forums, and special lectures will be held covering topics such as AI infrastructure, vertical industry AI application scenarios, AI innovation strategies, startup investment trends, and the future of an AI-driven life.

Additionally, NVIDIA GTC Taipei will be held from June 1–4 at the Taipei International Convention Center (TICC), with topics encompassing autonomous driving, physical AI, AI factories, digital twins, agentic AI, AI inference, open-source AI and large language models, scientific computing, and medical robotics applications.

InnoVEX Exhibition Scale Reaches 11-Year High — Nearly 500 Startups and Tech Companies from 23 Countries Exhibit Simultaneously

Positioned as the "Innovation Hub of Asia" and held concurrently with COMPUTEX TAIPEI, InnoVEX 2026 — Asia's largest tech startup exhibition — has reached its largest scale in 11 years, bringing together nearly 500 startups and tech companies from 23 countries. The exhibition highlights pioneering "NEXT AI" technologies including AI innovation, medical technology, semiconductors, robotics, smart mobility, and advanced communications.

There will be five categories of themed pavilions — national pavilions, government programs, industry-academia collaborations, local government initiatives, and domestic and international accelerators and CVCs. The 9 national pavilions will represent Australia, Canada, Czech Republic, France, Israel, Italy, Japan, South Korea, and Thailand. Participating accelerators include Garage+, Plug and Play Taiwan, and NVIDIA Inception. The Japan Bizcrew Pavilions, organized by Everidge, will also showcase the Lean Mobility’s Lean 3.

Hundreds of Demo Pitches, business matching sessions, and forums will be held on-site. On June 3, a Global Demo Day will be hosted, featuring presentations from 62 international startups and one-on-one matching sessions with VC/CVC. Forum topics will span driving real-world AI, global VC/CVC investment, and women leadership in tech, with speakers from NVIDIA, Amazon, and Micron Taiwan sharing their industry insights.

On June 3, Sandra Watson, President & CEO of the Arizona Commerce Authority, will personally lead a delegation to Taiwan to host "The Innovation Oasis – Arizona" forum, offering an in-depth look at how Arizona has become one of the fastest-growing startup ecosystems in the United States.

On June 4, Ankit J. Patel, Vice President of Developer Ecosystem at NVIDIA's U.S. headquarters, will give his insights on Taiwan's pivotal role in the global AI ecosystem.

The InnoVEX Pitch Contest will hold its final round on June 4, with contestants competing for startup resources and international business opportunities valued at nearly $180,000 USD in total.

Explore AI in the Real World! COMPUTEX Xinyi Venue Establishes Dedicated AI Zones for Robotics, ePaper Pavilions, TechXperiences, and More

TCA noted that according to a report by the United Nations Conference on Trade and Development (UNCTAD), the global AI market is projected to grow from $189 billion in 2023 to $4.8 trillion by 2033, underscoring AI’s role in improving efficiency across industries. To allow attendees to experience the real-world deployment of AI technology firsthand, the COMPUTEX Xinyi exhibition zone will feature a variety of themed displays showcasing AI applications in practice, including AI robotics, personalized ePaper applications, smart cities, and other digital technology AI implementations.

Taking the hottest topic of the year — AI robotics — as an example, exhibitors including AAEON, Ability Enterprise, Advantech, ELAN, EVERBRITE, Gamania, HIWIN, Intel, j-mex, Konten Networks, Lanner Electronics, Microip, MiTAC Information Technology, NEXCOM, Nuwa Robotics, Qadir, Shinyu, Solomon, Texas Instruments, TURVO, U-SCREWS, Vecow, WALRUS PUMP, Winmate, and YUAN will showcase AI robotics-related hardware and sensors, including AI robots, machine vision systems, servo motors, reducers, linear guideways, drives, robot controllers, AI computing chips, edge AI devices, and AI industrial computers.

Taking Intel as an example, the company will showcase at the Robotics & Edge AI Pavilion a range of products co-developed with AAEON, Advantech, Asustek, Circulus, MiTAC Information Technology, NEXCOM, Orisol, Vecow, and VinRobotics — all built around the Core Ultra Series 3 processor as the core — including humanoid robots, robots, robotic arms, AI robot industrial computers, and AI robotics modules.

Nuwa Robotics and Gamania will present at the "Human-Robot Interaction Pavilion" the all-new generation Kebbi 3, along with robotic products including Collibot and N300, as well as AI robots developed in collaboration with AI robot brain brand Vyin AI, integrated with vertical industry application scenarios. HIWIN plans to exhibit new products including a dual-arm robotic manipulator and planetary roller screws, alongside a logistics robot co-developed with an American robotics startup — which will also make its world debut at the show.

YUAN will showcase its next-generation 3D solid-state security solution — a deep integration of edge computing and AI platforms that leverages digital twin technology and 3D modeling to realize "ground-to-air integrated" smart city digital twin applications, spanning from ground-based AI patrol vehicles to cloud-connected aerial inspection systems.

E Ink will invite 40 ecosystem partners to participate in the ePaper Pavilion, showcasing large-format color ePaper displays — including a 75-inch E Ink Spectra 6 signage display, a 55-inch E Ink Marquee signage display, and a 75-inch E Ink Kaleido display — as well as consumer lifestyle product applications, collectively expanding the innovative possibilities of ePaper in the consumer market. On June 3, E Ink will host an International ePaper Innovation Forum, exploring topics such as "How ePaper is Breaking into Digital Out-of-Home (DOOH) Signage", "How Retail Media Networks (RMN) are Transforming Future Consumer Scenarios", and "Hands-on Experience Sharing: From Product Design to Mass Production of Color-Changing ePaper".

Complete AI Supply Chain Across the Cloud, Edge, and Terminal — Five Major Trends Driving Global AI Technology Forward

TCA noted that as AI continues its journey from cloud data centers toward the edge and the physical world, COMPUTEX has become a pivotal global AI exhibition, encompassing a complete supply chain spanning cloud, edge, and terminal AI applications. Five major trends encompass COMPUTEX 2026: "Evolution of AI Computing Infrastructure", "Rapid Real-World Deployment of Edge AI Applications", " Proliferation of AI PCs and Intelligent Endpoints", "Accelerated Development of Physical AI and Intelligent Robotics", and "Sustainable Technology and Energy-Efficient Design as Key Competitive Advantages".

Evolution of AI Computing Infrastructure:
The infrastructure that powers AI is rapidly evolving. With the popularization of generative AI, CSPs and enterprises require more powerful data centers, faster storage devices, and more efficient thermal management technologies. How to make AI run faster while consuming less power is the defining new trend in AI computing infrastructure. As a result, exhibits at the show will include high-end AI computing chips, AI servers, HBM, high-speed storage devices, high-speed optical communications networks, silicon photonics (CPO), liquid cooling systems, high-voltage direct current (HVDC) power systems, integrated power management platforms, and battery backup unit (BBU) modules.

Rapid Real-World Deployment of Edge AI Applications:
In the past, many AI functions required data to be sent back to the cloud for processing. However, thanks to advances in semiconductor manufacturing processes and the miniaturization of large language models (LLMs), many devices can now run AI models locally, performing AI inference directly at the edge. As a result, exhibits at the show will include AI industrial computers, AI workstations, AI embedded systems, robots, and drones, as well as edge AI solutions for smart manufacturing, smart retail, and smart healthcare.

Proliferation of AI PCs and Intelligent Endpoints:
AI is gradually becoming a standard feature of computers and smart devices. Many laptops, gaming devices, and networking devices are now beginning to incorporate built-in AI capabilities to enhance work productivity, content creation, multimedia entertainment, and high-speed connectivity. As a result, exhibits at the show will include AI PCs, AI laptops, AI industrial computers, AI SSDs, AI embedded systems, AI wireless routers, AI security systems, and AI TV chips.

Accelerated Development of Physical AI and Smart Robotics:
AI is beginning to enter the physical world. Previously, AI existed mostly on smartphone or computer screens, but now it is being applied to robots, drones, automated equipment, and more — enabling these devices to see, judge, and act on their own. Simply put, machines are becoming increasingly "intelligent." As a result, exhibits at the show will include robots, robotic arms, AMRs (Autonomous Mobile Robots), drones, and autonomous vehicles, as well as solutions with built-in Physical AI for smart industry, smart manufacturing, and smart cities.

Sustainable Technology and Energy-Efficient Design as Key Competitive Advantages:
Beyond high performance, low power consumption, low carbon emissions, and sustainable design have also become critical product directions. Examples include E Ink's full-color ePaper display modules, Sharp Taiwan's SHARP ePoster, and Delta Electronics' Liquid-to-Liquid Coolant Distribution Units (CDU) — all developed with energy savings and improved energy efficiency in mind. The ASUS ExpertBook Ultra business laptop focuses on "Circular Economy Model" and "Product Life Extension", effectively reducing electronic waste and helping enterprises achieve ESG carbon reduction goals through the use of eco-friendly recycled aluminum-magnesium alloy, a modular and easily maintainable design, and rigorous durability testing. All of these product and technology developments demonstrate that the technology industry is simultaneously advancing toward both high performance and green sustainability.

COMPUTEX 2026 Second Teaser Video Now Publicly Released — Watch It Online Today

TCA announced that pre-registration for COMPUTEX 2026 visitors is still open, and everyone is warmly welcome to inquire and register to attend. The COMPUTEX 2026 second teaser video has been publicly released and is now available to watch online at:  https://reurl.cc/7EqaQN.

■AAbout COMPUTEX
COMPUTEX TAIPEI was established and named during the tenure of Stan Shih, Chairman of the Taipei Computer Association (TCA). In 1985, the Taiwan External Trade Development Council (TAITRA) was invited to co-host the event. InnoVEX is a startup exhibition launched by the two organizations in 2016.

■About InnoVEX
InnoVEX is a leading startup platform in Asia held concurrently COMPUTEX. Jointly founded in 2016 by the Taipei Computer Association (TCA) and the Taiwan External Trade Development Council (TAITRA), it leverages COMPUTEX's advantage of attracting tens of thousands of ICT manufacturers and international buyers. This creates the world's only business matchmaking venue that simultaneously integrates international capital, corporate venture capital (CVC), supply chain partners, market channels, and media resources. Through its diverse exhibition formats, InnoVEX helps startup teams rapidly connect with the international market and amplify their creative impact, working together to build a global innovative technology ecosystem.

●About COMPUTEX TAIPEI 2026●
COMPUTEX 2026 Dates: June 2 – June 5, 2026
COMPUTEX 2026 Location: Taipei Nangang Exhibition Center (TaiNEX 1 & 2), Taipei World Trade Center (Hall 1), and Taipei International Convention Center (TICC)
COMPUTEX Official Website: https://www.computex.biz/
COMPUTEX Best Choice Award Website: https://bcaward.computex.biz/
COMPUTEX Facebook: https://www.facebook.com/ComputexTaipei
COMPUTEX YouTube: https://www.youtube.com/@COMPUTEXTAIPEIshow
COMPUTEX LinkedIn: https://www.linkedin.com/company/computex-taipei/

●About InnoVEX 2026●
InnoVEX 2026 Dates: June 2 – June 5, 2026
InnoVEX 2026 Location: Taipei Nangang Exhibition Hall 2 (TaiNEX 2), 4th Floor
InnoVEX Official Website: https://innovex.computex.biz/
InnoVEX Pitch Contest Website: https://innovex.computex.biz/show/pitch.aspx
InnoVEX LinkedIn: https://www.linkedin.com/company/innovextaipei/
InnoVEX Youtube: https://www.youtube.com/c/innovex_taipei
InnoVEX Facebook: https://www.facebook.com/computexinnovex

Back