RPC® inside G120次系統
A key highlight at Computex 2025 is Etron’s MemorAiLink platform, specifically designed for Edge AI applications. It supports high-bandwidth and customized memory configurations, offers turnkey memory interface IP services, reduces power consumption between logic chips and memory, and shortens product design cycles. The platform also enables cost-optimized heterogeneous integration packaging, tailored to customer needs for deploying real-world edge AI devices.
On display will be the RPC® inside G120 subsystem solution, a concrete implementation of the MemorAiLink platform. This solution features Etron’s self-developed RPC DRAM®, supporting x16 data bandwidth, and utilizes the industry’s smallest and most cost-effective FI-WLCSP packaging, which simplifies wiring and packaging design compared to traditional DDR3, significantly reducing system cost.
The complete subsystem integrates RPC DRAM, RPC controller, and a 3D depth image sensor chip developed by Etron’s subsidiary eYs3D, providing a comprehensive AI terminal solution for compact, low-power ASIC system designs used in specialized applications.
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