DOW™ Cooling Science Thermal Gel for 400G / 800G / 1.6T Optical Modules
DOW™ Cooling Science thermal gels are designed to address the demanding thermal management requirements of 400G, 800G, and 1.6T high-speed optical modules and high-power optical communication components. The material effectively fills microscopic gaps between heat-generating devices and heat dissipation structures, helping reduce interface thermal resistance and improve overall heat transfer efficiency.
With high thermal conductivity, low modulus, and excellent conformability, the thermal gel provides efficient heat transfer while minimizing mechanical stress on sensitive optical and electronic components. Its dispensing performance and process flexibility also support automated assembly and a wide range of optical module designs.
Key features include efficient thermal conductivity, low interface thermal resistance, excellent gap-filling capability, low mechanical stress, good material compatibility, and long-term reliability. Typical applications include DSPs, ASICs, lasers, driver ICs, TOSA/ROSA assemblies, and other heat-generating components.
DOW™ Cooling Science thermal gels help 400G, 800G, and 1.6T optical modules maintain stable operating temperatures under increasing power density and miniaturized designs, supporting improved system performance, reliability, and service life for AI data centers, cloud computing, and next-generation high-speed optical interconnects.