DOWSIL™ TC-7006導熱泥
DOWSIL™ TC-7006 Thermally Conductive Gel
No additional curing process required, non-flowing with excellent vertical gap stability up to 1.5mm thickness, low VOC, formulated for reliability, and reworkable to minimize waste. Ideal for thermal dissipation on laptop motherboard copper heat spreaders.
Passed Thermal Cycling Test
• Temperature Range: -40°C to 125°C
• Ramping time: 30 minutes; Dwell time: 30 minutes each at -40°C and 125°C
• Aged for 1,000 hours