Next-Generation AI Server Interconnect Solutions
Hon Hai Technology Group’s AI server interconnect solutions span four major technology areas.
For high-speed data transmission, the portfolio includes SOCAMM sockets, 224G Paladin HD2 backplane connectors, PCIe Gen6 risers, 1.6T DAC/ACC/AEC high-speed cables, and 1.6T optical transceiver modules, addressing the high-bandwidth and low-latency requirements of AI and HPC applications. The Paladin HD2 supports 224 Gb/s PAM4 and bandwidth of up to 67 GHz.
Power solutions include M-PIC, busbars, AC connectors, and AC whips, all designed to comply with the OCP ORv3 architecture. Liquid-cooled busbars can support up to 480 kW of rack power delivery at 48 VDC and at least 5,000 A. For liquid cooling, Hon Hai offers quick-disconnect products such as the UQD08 and 2-inch FFQD, featuring leak-free performance, high mating-cycle durability, and corrosion resistance.
For high-speed networking, Hon Hai is further expanding into CPO, XPO, and ChipLink 448G technologies. The CPO ELSFP features eight CW lasers and supports 200 Gbps per channel. A single XPO module delivers up to 12.8 Tbps, while each OCP rack unit can reach 204.8 Tbps. The solution also integrates cold-plate cooling with up to 400 W thermal dissipation capacity, providing a comprehensive solution spanning server-level interconnects, power delivery and thermal management to high-speed networking for AI data centers.